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TGC - the only one of its kind in the world!
PBI-Dansensor has years ago developed a unique instrument - the TGC. This instrument is the only one of its kind in the world. The unique feature in Dansensor Module TGC-2 (Total Gas Control) are automation of the gas purging process on a flow packaging machine (horizontal or vertical). Thus, the TGC automatically supplies the gas needed for reaching and maintaining the oxygen level pre-set by the operator before sealing the package.
In order to avoid this to happen, the operator tends to over-purge. This, however, is expensive and is not a very reliable method. TGC offers a solution to this problem. The on-line gas analyser (O2) in the TGC is continuously and near real time measuring the actual oxygen content in the package via the sampling hose, placed near the sealing area. The measured oxygen level is via the TGC software continuously compared to the O2 level, pre-set by the operator for this particular package. If the oxygen level is too high, the proportional flow regulator is asked to give more gas, thus purging away more atmospheric air. If the oxygen level is too low, less gas will be supplied. The target is to maintain the oxygen level in a "window" defined by the O2 minimum and maximum accepted levels. In addition to the gas analyser and proportional flow regulator TGC also features a gas mixer (optionally), which can be either manually or electronically controlled. Oxygen is the control gas for the flow regulator, but TGC can also (optionally) be fitted with a CO2 sensor, so that CO2 and O2 are measured simultaneously (however, only the O2 level is used for flow adjustment). TGC is with its touch screen and menu structure very easy to operate. The different parameters for the TGC are set up in programmes (99 programmes). The operator does not need to reset the parameters, he only has to choose a new programme and the TGC will set itself up automatically. This also applies to the gas mixer, if the electronic option is chosen. The programme selection procedure can be interfaced with the packaging machine (only on OEM level).
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